BA389E3-V

SMD Pick & Place Machine

Details

The BA389E3-V and BA389CY-E3-V models have been specially developed for fast and high-precision assembly of large batch sizes. These models are equipped with an optical centering system that enables “vision on the fly” image processing directly on the placement head using a digital camera. It guarantees optimum measurement of SMD components such as 01005, SOIC, PLCC, BGA, uBGA, CSP & QFP as well as odd-form components up to 0.3 mm pitch.

Specifications

BA389E3-V

  • Number of heads (vision on the fly): 3
  • Placement speed: 12000 BT/hour, 10500 BT/hour (IPC 9850)
  • Feeder capacity (8mm): up to 160 belt feeders
  • IC tray capacity: up to 3 waffle trays
  • Component recognition: by image processing
  • Component size:
    • Measurement with digital head camera:
      • smallest: 0.4 x 0.2mm
      • largest: 150 x 100mm
    • Measurement with stationary digital camera:
      • largest: 150 x 100mm
  • Resolution:
    • X/Y axis: 0.005mm
    • Z axis: 0.01mm
    • Rotation: 0° to 360° (0.09°/step)
  • Positioning accuracy: +/- 0.03mm
  • Repeat accuracy: +/- 0.01 mm
  • Loading area without conveyor belt:
    • without waffle tray: 650x460mm
    • with 1 waffle tray: 650x380mm
  • Loading area with conveyor belt (BA389CY-E3-V):
    • without waffle tray: 650x440mm
    • with 1 waffle tray: 650x380mm
  • Programming:
    • Direct input
    • Teach-in via camera
    • CAD connection (optional)
    • Barcode reader (optional)
    • Traceability of production data (optional)
  • Industrial PC with Windows 10 (English version)
  • Power supply unit: 230VAC
  • Power: 3800W
  • Pressure: 75 psi (5.5 bar), max. 300l/min
  • Dimensions: 1300x1420x1460mm
  • Weight: 1100kg
  • * Subject to technical changes.

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